国际顶尖MBA申请交流平台--TOPWAY MBA

标题: [转帖]In @ Chicago with scholarship [打印本页]

作者: wuweimao 时间: 2008-4-1 15:24 标题: [转帖]In @ Chicago with scholarship

Received email last night and got phone call tonight. With some scholarship. Very happy!

Good luck to all!

作者: wuweimao 时间: 2008-4-1 15:24

背景：

GMAT: 770, TOEFL: 117, Undergrad GPA: 3.7, 5.5 yr W/E

作者: wuweimao 时间: 2008-4-1 15:26

In @ Wharton!!!

还收到了wharton的

Just received phone call from Wharton. Finally made it!!!

It is a night of miracles!

I was interviewed in HK. Mostly likely would choose Wharton.

作者: bettyofarim 时间: 2008-4-2 09:05

是个牛人

欢迎光临国际顶尖MBA申请交流平台--TOPWAY MBA (http://forum.topway.org/)